Polyimides and Other High Temperature Polymers Synthesis, Characterization and Applications

This volume chronicles the proceedings of the "International Symposium on Polyimides and Other High Temperature Polymers: Synthesis, Characterization and Applications, held in Newark, New Jersey, November 29 December 1, 1999. Polyimides constitute an important class of materials because of their many desirable traits, for example: low dielectric constant, high breakdown voltage, good planarization, wear resistance, radiation resistance, inertness to solvents, good adhesion properties, good hydrolytic stability, low thermal expansion, long-term stability and excellent mechanical properties.This volume contains a total of 21 papers, all rigorously peer reviewed and revised before inclusion, addressing many aspects and new developments in polyimides and other high temperature polymers. The book is divided into two parts: "Synthesis, Properties and Bulk Characterization" and" Interfacial or Adhesion Aspects and Applications." The topics covered include: structure-property relationships in polyimides; photochemistry and photophysics of polyimides; thermal and UV laser pyrolyses of polyimides; residual stress evaluation in polyimides; synthesis and characterization of a variety of polyimides; high Tg polyimide; fluorinated polyimides; highly oriented polyimide films; high-temperature aromatic copolymer thermosets; shape-memory polymers; polyimides as liquid crystal alignment layers; surface properties of polyimides; metal-containing polyimides for optoelectronic applications; polyimide L-B films; polyimides coated with copper sulfide; carbon fiber/polyimide composites; and simulations of the polyimide/silica interface.This volume offers a wealth of information and representscurrent commentary on the R&D activity taking place in the technologically highly importantMittal, K. L. is the author of 'Polyimides and Other High Temperature Polymers Synthesis, Characterization and Applications' with ISBN 9789067643399 and ISBN 9067643394.