Stress Induced Phenomena in Metallization Sixth International Workshop on Stress Induced Phenomena in Metallization, Ithaca, New York 25-27 July 2001

Tiny metal structures, less than a millionth of a meter across, are critical building blocks in a number of high-tech devices such as computer chips. These "metallizations" are subjected to extreme conditions of temperature, electric current density, and mechanical load, which may cause the device they are in to fail. This book contains research papers on these metallizations and on the reliability problems associated with them. The papers were peer reviewed for these proceedings.Baker, Shefford P. is the author of 'Stress Induced Phenomena in Metallization Sixth International Workshop on Stress Induced Phenomena in Metallization, Ithaca, New York 25-27 July 2001', published 2002 under ISBN 9780735400580 and ISBN 073540058X.