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6203421

9780442013530

Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid

Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid
$103.17
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Product details

  • ISBN-13: 9780442013530
  • ISBN: 0442013531
  • Publication Date: 1992
  • Publisher: Wiley & Sons, Incorporated, John

AUTHOR

Hwang, Jennie S.

SUMMARY

Hwang, Jennie S. is the author of 'Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid', published 1992 under ISBN 9780442013530 and ISBN 0442013531.

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