1458706

9780471594369

Quality Conformance and Qualification of Microelectronic Packages and Interconnects
Quality Conformance and Qualification of Microelectronic Packages and Interconnects
$94.70
$3.95 Shipping
List Price
$175.00
Discount
45% Off
You Save
$80.30

  • Condition: New
  • Provider: Ergodebooks Contact
  • Provider Rating:
    85%
  • Ships From: Multiple Locations
  • Shipping: Standard
  • Comments: Buy with confidence. Excellent Customer Service & Return policy. Ships Fast. 24*7 Customer Service.

   30-day money back guarantee
$18.60
$3.95 Shipping
List Price
$175.00
Discount
89% Off
You Save
$156.40

  • Condition: Good
  • Provider: Bookbyte Contact
  • Provider Rating:
    89%
  • Ships From: Salem, OR
  • Shipping: Standard, Expedited (tracking available)
  • Comments: May include moderately worn cover, writing, markings or slight discoloration. SKU:9780471594369-4-0-3 Orders ship the same or next business day. Expedited shipping within U.S. will arrive in 3-5 days. Hassle free 14 day return policy. Contact Customer Service for questions.

   30-day money back guarantee
$16.00
$3.95 Shipping

Your due date: 5/31/2017

How do rentals work?
$175.00
List Price
$175.00
Discount
90% Off
You Save
$159.00

  • Condition: Good
  • Provider: Rent U Contact
  • Provider Rating:
    86%
  • Ships From: Salem, OR
  • Shipping: Standard, Expedited
  • Comments: May include moderately worn cover writing markings or slight discoloration.

   30-day money back guarantee

Ask the provider about this item.

Most renters respond to questions in 48 hours or less.
The response will be emailed to you.
Cancel
  • ISBN-13: 9780471594369
  • ISBN: 0471594369
  • Publisher: Wiley & Sons, Incorporated, John

AUTHOR

SUMMARY

All packaging engineers and technologists who want to ensure that they give their customers the highest quality, most cost-effective products should know that the paradigm has shifted. It has shifted away from the MIL-STDs and other government standards and test procedures that don't cost-effectively address potential failure mechanisms or the manufacturing processes of the product. It has shifted decisively towards tackling the root causes of failure and the appropriate implementation of cost-effective process controls, qualityscreens, and tests. This book's groundbreaking, science-based approach to developing qualification and quality assurance programs helps engineers reach a new level of reliability in today's high-performance microelectronics. It does this with powerful... Techniques for identifying and modeling failure mechanisms earlier in the design cycle, breaking the need to rely on field data Physics-of-failure product reliability assessment methods that can be proactively implemented throughout the design and manufacture of the product Process controls that decrease variabilities in the end product and reduce end-of-line screening and testing A wide range of microelectronic package and interconnect configurations for both single-and multi-chip modules is examined, including chip and wire-bonds, tape-automated (TAB), flip-TAB, flip-chip bonds, high-density interconnects, chip-on-board designs (COB), MCM, 3-D stack, and many more. The remaining package elements, such as die attachment, case and lid, leads, and lid and lead seals are also discussed in detail. The product of a distinguished team of authors and editors, this book's guidelines for avoiding potential high-risk manufacturing and qualification problems, as well as for implementing ongoing quality assurance, are sure to prove invaluable to both students and practicing professionals. For the professional engineer involved in the design and manufacture of products containing electronic components, here is a comprehensive handbook to the theory and methods surrounding the assembly of microelectronic and electronic components. The book focuses on computers and consumer electronic products with internal subsystems that reflect mechanical design constraints, cost limitations, and aesthetic and ergonomic concerns. Taking a total system approach to packaging, the book systematically examines: basic chip and computer architecture; design and layout; interassembly and interconnections; cooling scheme; materials selection, including ceramics, glasses, and metals; stress, vibration, and acoustics; and manufacturing and assembly technology. 1994 (0-471-53299-1) 800 pp. INTEGRATED CIRCUIT, HYBRID, AND MULTICHIP MODULE PACKAGE DESIGN GUIDELINES: A Focus on Reliability -Michael Pecht This comprehensive guide features a uniquely organized time-phased approach to design, development, qualification, manufacture, and in-service management. It provides step-by-step instructions on how to define realistic system requirements, define the system usage environment, identify potential failure modes, characterize materials and processes by the key control label factors, and use experiment, step-stress, and accelerated methods to ensure optimum design before production begins. Topics covered include: detailed design guidelines for substrate...wire and wire, tape automated, and flip-chip bonding...element attachment and case, lead, lead and lid seals-incorporating dimensional and geometric configurations of package elements, manufacturing and assembly conditions, materials selection, and loading conditions. 1993 (0-471-59446-6) 454 pp.Evans, John W. is the author of 'Quality Conformance and Qualification of Microelectronic Packages and Interconnects' with ISBN 9780471594369 and ISBN 0471594369.

[read more]

Questions about purchases?

You can find lots of answers to common customer questions in our FAQs

View a detailed breakdown of our shipping prices

Learn about our return policy

Still need help? Feel free to contact us

View college textbooks by subject
and top textbooks for college

The ValoreBooks Guarantee

The ValoreBooks Guarantee

With our dedicated customer support team, 30-day no-questions-asked return policy, and our price match guarantee, you can rest easy knowing that we're doing everything we can to save you time, money, and stress.