The only book to teach microsystems packaging--written by the field's leading author This is the book that engineers, technicians, and students want the first to teach microsystems packaging from the ground up. Rao Tummala's one-stop Fundamentals to Microsystems Packaging covers the field from wafer to systems, including every major contributing technology. It's the only book to do so. This much-needed tool features:*A comprehensive tutorial covering every major aspect of microelectronics, photonics, RF, packaging design, assembly, reliability, testing, manufacturing and its relevance to both semiconductors and systems. *Rigorous coverage of electrical, mechanical, chemical, and materials aspects of each technology *Easy-to-read schematics and block diagrams *Fundamental approaches to all system issues *Examples of all common configurations and technologies wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others *Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes *Basics of electrical and reliability testing *Hundreds of explanatory two-color illustrations *Self-test problems and solutions in every chapter *Glossary *The best way to learn microsystems packaging through self-study or in a classroom and the most comprehensive on-the-job referenceMICROSystems PACKAGING FROM THE GROUND UPChapman, Steve is the author of 'Fundamentals of Microsystems Packaging', published 2001 under ISBN 9780071371698 and ISBN 0071371699.