Fundamentals of Microsystems Packaging

Fundamentals of Microsystems Packaging
$3.95 Shipping
  • Condition: New
  • Provider: gridfreed Contact
  • Provider Rating:
  • Ships From: San Diego, CA
  • Shipping: Standard
  • Comments: New. In shrink wrap. Looks like an interesting title!

seal   30-day money back guarantee

Ask the provider about this item.

Most renters respond to questions in 48 hours or less.
The response will be emailed to you.
  • ISBN-13: 9780071371698
  • ISBN: 0071371699
  • Edition: 1
  • Publication Date: 2001
  • Publisher: McGraw-Hill Professional Publishing


Chapman, Steve, Tummala, Rao


The only book to teach microsystems packaging--written by the field's leading author This is the book that engineers, technicians, and students want the first to teach microsystems packaging from the ground up. Rao Tummala's one-stop Fundamentals to Microsystems Packaging covers the field from wafer to systems, including every major contributing technology. It's the only book to do so. This much-needed tool features:*A comprehensive tutorial covering every major aspect of microelectronics, photonics, RF, packaging design, assembly, reliability, testing, manufacturing and its relevance to both semiconductors and systems. *Rigorous coverage of electrical, mechanical, chemical, and materials aspects of each technology *Easy-to-read schematics and block diagrams *Fundamental approaches to all system issues *Examples of all common configurations and technologies wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others *Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes *Basics of electrical and reliability testing *Hundreds of explanatory two-color illustrations *Self-test problems and solutions in every chapter *Glossary *The best way to learn microsystems packaging through self-study or in a classroom and the most comprehensive on-the-job referenceMICROSystems PACKAGING FROM THE GROUND UPChapman, Steve is the author of 'Fundamentals of Microsystems Packaging', published 2001 under ISBN 9780071371698 and ISBN 0071371699.

[read more]

Questions about purchases?

You can find lots of answers to common customer questions in our FAQs

View a detailed breakdown of our shipping prices

Learn about our return policy

Still need help? Feel free to contact us

View college textbooks by subject
and top textbooks for college

The ValoreBooks Guarantee

The ValoreBooks Guarantee

With our dedicated customer support team, you can rest easy knowing that we're doing everything we can to save you time, money, and stress.