Chemical-Mechanical Planarization Vol. 767 : 2003 MRS Spring Meeting Symposium Proceedings

Out of Stock

The item you're looking for is currently unavailable.

Ask the provider about this item.

Most renters respond to questions in 48 hours or less.
The response will be emailed to you.
  • ISBN-13: 9781558997042
  • ISBN: 1558997040
  • Publication Date: 2003
  • Publisher: Materials Research Society


Oliver, M. R., Boning, D. S., Stein, D. J.


Chemical-mechanical planarization (CMP) has emerged as a critical fabrication technology for advanced integrated circuits. Even as the applications of CMP have diversified and we have begun to understand aspects of the physics and chemistry of the process, a new generation of CMP innovations is unfolding. New slurries and consumables are under development. New applications to novel devices continue to appear. This volume, the most recent in a successful series on CMP, offers a review of the advances to date and provides a comprehensive discussion of the future challenges that must be overcome. Presentations from academia, government labs and industry are featured.Oliver, M. R. is the author of 'Chemical-Mechanical Planarization Vol. 767 : 2003 MRS Spring Meeting Symposium Proceedings', published 2003 under ISBN 9781558997042 and ISBN 1558997040.

[read more]

Questions about purchases?

You can find lots of answers to common customer questions in our FAQs

View a detailed breakdown of our shipping prices

Learn about our return policy

Still need help? Feel free to contact us

View college textbooks by subject
and top textbooks for college

The ValoreBooks Guarantee

The ValoreBooks Guarantee

With our dedicated customer support team, you can rest easy knowing that we're doing everything we can to save you time, money, and stress.