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Publication Date: 2003
Publisher: Materials Research Society
Oliver, M. R., Boning, D. S., Stein, D. J.
Chemical-mechanical planarization (CMP) has emerged as a critical fabrication technology for advanced integrated circuits. Even as the applications of CMP have diversified and we have begun to understand aspects of the physics and chemistry of the process, a new generation of CMP innovations is unfolding. New slurries and consumables are under development. New applications to novel devices continue to appear. This volume, the most recent in a successful series on CMP, offers a review of the advances to date and provides a comprehensive discussion of the future challenges that must be overcome. Presentations from academia, government labs and industry are featured.Oliver, M. R. is the author of 'Chemical-Mechanical Planarization Vol. 767 : 2003 MRS Spring Meeting Symposium Proceedings', published 2003 under ISBN 9781558997042 and ISBN 1558997040.