336271

9780071428293

Area Array Packaging Processes for Bga, Flip Chip, and Csp

Area Array Packaging Processes for Bga, Flip Chip, and Csp
$187.12
$3.95 Shipping
  • Condition: New
  • Provider: Ergodebooks Contact
  • Provider Rating:
    83%
  • Ships From: Multiple Locations
  • Shipping: Standard
  • Comments: Buy with confidence. Excellent Customer Service & Return policy. Ships Fast. 24*7 Customer Service.

   30-day money back guarantee
$13.11
$3.95 Shipping
List Price
$129.50
Discount
89% Off
You Save
$116.39

  • Condition: Good
  • Provider: Ergodebooks Contact
  • Provider Rating:
    83%
  • Ships From: Multiple Locations
  • Shipping: Standard
  • Comments: Buy with confidence. Excellent Customer Service & Return policy. Ships Fast. 24*7 Customer Service.

   30-day money back guarantee

Ask the provider about this item.

Most renters respond to questions in 48 hours or less.
The response will be emailed to you.
Cancel
  • ISBN-13: 9780071428293
  • ISBN: 0071428291
  • Publisher: McGraw-Hill Professional Publishing

AUTHOR

Gilleo, Ken

SUMMARY

This expert monograph on area array packaging processes delivers concise coverage of leading-edge assembly and manufacturing methods. Featuring the manufacturing processes and equipment of today's state-of-the-art electronic packaging, clearly explained by a team of world-class professionals and researchers, Area Array Packaging Processes and Equipment details cost-effective manufacturing methods you won't find elsewhere. Look inside for: * Expert information on key processes * Cutting-edge, in-depth coverage of processes for each area array technology * Data on flip chip materials, processes, assembly, and underfilling * BGA and CSP rework solutions * Detailed descriptions of die-attach methods, materials, and rework * Coverage of liquid encapsulation equipment and processes and molding for area array packaging * Discussions of cost, quality, reliability, cycling, tooling, failure mechanisms, productivity, and moreGilleo, Ken is the author of 'Area Array Packaging Processes for Bga, Flip Chip, and Csp' with ISBN 9780071428293 and ISBN 0071428291.

[read more]

Questions about purchases?

You can find lots of answers to common customer questions in our FAQs

View a detailed breakdown of our shipping prices

Learn about our return policy

Still need help? Feel free to contact us

View college textbooks by subject
and top textbooks for college

The ValoreBooks Guarantee

The ValoreBooks Guarantee

With our dedicated customer support team, 30-day no-questions-asked return policy, and our price match guarantee, you can rest easy knowing that we're doing everything we can to save you time, money, and stress.