Showing 1 - 20 of 20 Results
2.
Electronics Manufacturing With Lead-Free, Haogen Free, and Conductive Adhesive Materials by Lau, John H., Wong, C. P., ... ISBN: 9780071386241 List Price: $125.00
3.
Thermal Stress and Strain in Microelectronics Packaging by Lau, John H. ISBN: 9780442010584 List Price: $99.95
4.
Electronic Packaging Design, Materials, Process, and Reliability by Lau, John H., Nakayama, Wat... ISBN: 9780070371354 List Price: $69.00
5.
Chip Scale Packaging Design, Materials, Processes and Realiablity, and Applications by Lau, John H., Lee, S. W. Ricky ISBN: 9780070383043 List Price: $89.50
6.
Solder Joint Reliability of Bga, Csp, Flip Chip, and Fine Pitch Smt Assemblies by Lau, John H., Pao, Yi-Hsin ISBN: 9780070366480 List Price: $65.00
7.
Fan-Out Wafer-Level Packaging by Lau, John H. ISBN: 9789811088834 List Price: $199.99
8.
Ball Grid Array Technology by Lau, John H. ISBN: 9780070366084 List Price: $85.00
9.
Flip Chip Technologies by Lau, John H. ISBN: 9780070366091 List Price: $89.00
10.
Low Cost Flip Chip Technologies For Dca, Wlcsp, and Pbga Assemblies by Lau, John H. ISBN: 9780071351416 List Price: $89.95
11.
Handbook of Tape Automated Bonding by Lau, John H. ISBN: 9780442004279 List Price: $299.00
12.
Microvias Low Cost, High Density Interconnects by Lau, John H., Lee, Ricky S. W. ISBN: 9780071363273 List Price: $99.95
13.
Handbook Of Fine Pitch Surface Mount Technology (Electrical Engineering) by John H. Lau ISBN: 9780442012588 List Price: $212.50
14.
Second Skin : The Screenplay by Lau, John H. ISBN: 9781593001124 List Price: $19.95
15.
Solder Joint Reliability by Lau, John H. ISBN: 9781461539117 List Price: $24.99
16.
Solder Joint Reliability : Theory and Applications by Lau, John H. ISBN: 9781461367437 List Price: $378.00
17.
Heterogeneous Integrations by Lau, John H. ISBN: 9789811372230 List Price: $159.99
18.
Heterogeneous Integrations by Lau, John H. ISBN: 9789811372261 List Price: $119.99
19.
Fan-Out Wafer-Level Packaging by Lau, John H. ISBN: 9789811342660 List Price: $139.99
20.
Assembly and Reliability of Lead-Free Solder Joints by Lau, John H., Lee, Ning-Cheng ISBN: 9789811539190 List Price: $179.99