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1996 International Conference on Simulation of Semiconductor Processes and Devices Sispad '96 September 2-4, 1996, Toyo University, Hakusan Campus, Tokyo, Japan

by

IEEE, Electron Devices Society Staff

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1996 International Conference on Simulation of Semiconductor Processes and Devices Sispad '96 September 2-4, 1996, Toyo University, Hakusan Campus, Tokyo, Japan, ISBN 9780780327450 Own This Book? Sell It
ISBN-13:

9780780327450

ISBN:

0780327454

Publisher: IEEE Summary: This conference is aimed at providing an opportunity for the presentation and discussion of the recent topics in process, device and circuit modeling for semiconductors. The proceedings contains all papers presented at the conference which are carefully selected by experts in the field. A valuable source and indispensable for all scientists and engineers engaged in research and development in semiconductor devices, t [read more]
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Product Details
ISBN-13:

9780780327450


ISBN:

0780327454


Publisher: IEEE

This conference is aimed at providing an opportunity for the presentation and discussion of the recent topics in process, device and circuit modeling for semiconductors. The proceedings contains all papers presented at the conference which are carefully selected by experts in the field. A valuable source and indispensable for all scientists and engineers engaged in research and development in semiconductor devices, the proceedings include a wide range of TCAD algorithms to user interfacesProcess Modeling; Impurity Modeling; Future Device Modeling; Advanced Silicon Device Modeling; Equipment and Topography Modeling; Mesh Generation and Circuit Model

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