1996 International Conference on Simulation of Semiconductor Processes and Devices Sispad '96 September 2-4, 1996, Toyo University, Hakusan Campus, Tokyo, Japan
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9780780327450
ISBN:0780327454
Publisher: IEEE Summary: This conference is aimed at providing an opportunity for the presentation and discussion of the recent topics in process, device and circuit modeling for semiconductors. The proceedings contains all papers presented at the conference which are carefully selected by experts in the field. A valuable source and indispensable for all scientists and engineers engaged in research and development in semiconductor devices, t [read more]- 30-Day No-Hassle Returns
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9780780327450
ISBN:
0780327454
Publisher: IEEE
This conference is aimed at providing an opportunity for the presentation and discussion of the recent topics in process, device and circuit modeling for semiconductors. The proceedings contains all papers presented at the conference which are carefully selected by experts in the field. A valuable source and indispensable for all scientists and engineers engaged in research and development in semiconductor devices, the proceedings include a wide range of TCAD algorithms to user interfacesProcess Modeling; Impurity Modeling; Future Device Modeling; Advanced Silicon Device Modeling; Equipment and Topography Modeling; Mesh Generation and Circuit Model
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